Load the Stencil
Place the workpiece into the cleaning chamber.
SMT Cleaning Solution
Automated aqueous stencil cleaning system with DI water rinsing, precision filtration and hot-air drying for SMT production.


Product Overview
BC320 integrates aqueous cleaning, DI water rinsing and hot-air drying into one automated process for common SMT cleaning tasks.
Integrated Process
A five-step workflow brings aqueous washing, DI water rinsing and hot-air drying together in one BC320 cycle.
Place the workpiece into the cleaning chamber.
Water-based cleaning liquid is sprayed onto the stencil.
DI water rinses remaining cleaning residues.
Hot-air drying removes residual moisture after rinsing.
Remove the cleaned, dried stencil after the cycle.
Working Principle
Wash liquid and DI water follow separate circulation paths, each with 1 μm filtration and recovery back to its respective tank.
Engineered Cleaning System
The BC320 combines its cleaning, rinse, filtration, drying and control functions in one machine platform.
Four fixed cleaning spray rods support the wash process.
Four fixed air knives are part of the machine design.
The stencil moves during cleaning as part of the mechanism.
Cleaning liquid and DI rinse water use 1 μm filtration.
Wash liquid and DI water follow separate process paths.
Hot air blow drying is specified up to 90°C.
PLC-controlled cleaning procedures are operated from the panel.
English color touch-panel operational interface.
Wash liquid and rinse water can be added and discharged automatically.
A large right-side observation window makes the process visible.

Machine Structure
Water-based cleaning liquid is sprayed onto the stencil. Cleaning time and liquid temperature can be adjusted.
DI water rinses remaining cleaning residues. Rinse time and water temperature can be configured.
Hot-air drying removes residual moisture after rinsing. Drying time and hot-air temperature can be adjusted.
Internal Components
Images below are sourced from the BC320 product introduction and show key internal assemblies.

Houses the cleaning area for the workpiece during the wash process.

Provides fine filtration for circulating cleaning and rinse media.

Provides circulation pressure for the cleaning process.

Stores cleaning liquid used during the wash process.

Supports the machine drying process.

Part of the machine's controlled fluid handling system.



PLC & Touch-Screen Control
The BC320 uses an English color touch-panel interface with PLC procedure control. Its settings and pressure monitoring are presented at the machine.
Applications
BC320 is presented for the following SMT cleaning applications in the supplied product information.
Cleaning Results
Comparison images are reproduced from the BC320 product introduction without alteration.
Before / After


Before / After


Before / After


Real Machine Video
See the BC320 machine, cleaning chamber, touch-screen interface and operating process in this real-machine demonstration.
Technical Specifications
Values below are organized from the supplied BC320 Machine Spec page.
| Item | Specification |
|---|---|
| Model | BC320 |
| Maximum stencil size | 737 × 737 × 40 mm |
| Cleaning liquid tank | 60 L |
| DI water tank | 60 L |
| Wash time (solder paste stencil) | 3–5 min |
| Rinse time (solder paste stencil) | 1–2 min |
| Drying time (solder paste stencil) | 3–6 min |
| Wash / rinse pressure | 4–5 kg/cm² |
| Cleaning liquid | Water-based cleaning liquid |
| Rinse medium | DI water |
| Drying method | Hot air blow drying |
| Cleaning liquid temperature | 0–60°C |
| Hot air temperature | 0–90°C |
| Cleaning liquid heater | 9 kW |
| DI water heater | 9 kW |
| Hot air heater | 6 kW |
| Cleaning / rinse filtration | 1 μm / 1 μm |
| Power supply | AC 380 V, 50/60 Hz |
| Rated power | 28 kW |
| Compressed air | 0.5–0.7 MPa |
| Net weight | 730 kg |
| Machine dimensions | 1300 × 1400 × 1950 mm |
FAQ
Answers below are limited to the supplied product introduction and machine specification.
It is presented for SMT solder paste stencils, red glue stencils, red glue copper stencils, solder paste misprinted PCBs, squeegees and PCBA.
The maximum stencil size is 737 × 737 × 40 mm.
Yes. DI water is specified as the rinse medium, with a 60 L DI water tank.
The machine specification lists hot air blow drying, with a hot-air temperature range of 0–90°C.
Cleaning and rinse filtration are both specified as 1 μm.
The machine is specified for AC 380 V, 50/60 Hz power, rated at 28 kW, and compressed air at 0.5–0.7 MPa. It uses water-based cleaning liquid and DI water.
Technical DocumentsDownload the original BC320 product introduction supplied with this page.
Download BC320 Product IntroductionTalk to Southern Machinery
Tell us your stencil size, cleaning material and process requirements. We can help you evaluate whether the BC320 is suitable for your application.
For a quote or application discussion, contact the Southern Machinery team directly.