SMT Cleaning Solution

BC320 Stencil
Cleaning Machine

Automated aqueous stencil cleaning system with DI water rinsing, precision filtration and hot-air drying for SMT production.

  • 737 × 737 mmMax. Stencil Size
  • 60 L + 60 LWash / Rinse Tanks
  • 1 μmFiltration
  • Wash · Rinse · DryIntegrated Process
Southern Machinery BC320 stencil cleaning machine
BC320Designed for aqueous stencil cleaning, DI water rinsing and hot-air drying.
4–5 kg/cm²Wash / rinse pressure
0–90°CHot-air temperature
28 kWRated power
730 kgNet weight
Real BC320 machine Front view of the BC320 stencil cleaning machine

Product Overview

Automated Stencil Cleaning for SMT Production

BC320 integrates aqueous cleaning, DI water rinsing and hot-air drying into one automated process for common SMT cleaning tasks.

  • Solder Paste Stencils
  • Red Glue Stencils
  • Copper Stencils
  • Misprinted PCBs
  • Squeegees
  • PCBA

Integrated Process

A Clear, Repeatable Cleaning Sequence

A five-step workflow brings aqueous washing, DI water rinsing and hot-air drying together in one BC320 cycle.

01

Load the Stencil

Place the workpiece into the cleaning chamber.

02

Aqueous Wash

Water-based cleaning liquid is sprayed onto the stencil.

03

DI Water Rinse

DI water rinses remaining cleaning residues.

04

Hot Air Dry

Hot-air drying removes residual moisture after rinsing.

05

Unload

Remove the cleaned, dried stencil after the cycle.

Working Principle

Two Media Loops, One Integrated Process

Wash liquid and DI water follow separate circulation paths, each with 1 μm filtration and recovery back to its respective tank.

WASH LOOP
  • Cleaning liquid
  • Pump
  • Spray nozzles
  • Stencil
  • 1 μm filtration
  • Liquid recovery
RINSE LOOP
  • DI water
  • Pump
  • Spray nozzles
  • Stencil
  • 1 μm filtration
  • Water recovery
↗Hot Air Drying follows the wash and DI water rinse stages.

Engineered Cleaning System

Key Design Features of the BC320

The BC320 combines its cleaning, rinse, filtration, drying and control functions in one machine platform.

04

Fixed Spray Rods

Four fixed cleaning spray rods support the wash process.

04

Fixed Air Knives

Four fixed air knives are part of the machine design.

↔

Moving Stencil Mechanism

The stencil moves during cleaning as part of the mechanism.

1μ

Real-Time Filtration

Cleaning liquid and DI rinse water use 1 μm filtration.

⇄

Separate Media Systems

Wash liquid and DI water follow separate process paths.

♨

Hot-Air Drying

Hot air blow drying is specified up to 90°C.

PLC

PLC Control

PLC-controlled cleaning procedures are operated from the panel.

HMI

Touch-Screen Interface

English color touch-panel operational interface.

↧

Automatic Liquid Handling

Wash liquid and rinse water can be added and discharged automatically.

◫

Observation Window

A large right-side observation window makes the process visible.

BC320 machine structure diagram
BC320 machine structure illustration from the product introduction.

Machine Structure

Three Main Process Modules

  1. Wash

    Water-based cleaning liquid is sprayed onto the stencil. Cleaning time and liquid temperature can be adjusted.

  2. Rinse

    DI water rinses remaining cleaning residues. Rinse time and water temperature can be configured.

  3. Dry

    Hot-air drying removes residual moisture after rinsing. Drying time and hot-air temperature can be adjusted.

Internal Components

Inside the BC320

Images below are sourced from the BC320 product introduction and show key internal assemblies.

BC320 wash cabinet

Wash Cabinet

Houses the cleaning area for the workpiece during the wash process.

BC320 filter barrel

Filter Barrel

Provides fine filtration for circulating cleaning and rinse media.

BC320 electric pump

Electric Pump

Provides circulation pressure for the cleaning process.

BC320 liquid tank

Liquid Tank

Stores cleaning liquid used during the wash process.

BC320 air blower

Air Blower

Supports the machine drying process.

BC320 solenoid valve assembly

Solenoid Valve

Part of the machine's controlled fluid handling system.

BC320 touch-screen HMI during a machine cycle
BC320 touch screen and panel controls
Control panel
BC320 cleaning-chamber observation window
Observation window

PLC & Touch-Screen Control

Set the Process Parameters at the Panel

The BC320 uses an English color touch-panel interface with PLC procedure control. Its settings and pressure monitoring are presented at the machine.

  • Adjustable wash time
  • Adjustable cleaning-liquid temperature
  • Adjustable rinse time
  • Adjustable rinse-water temperature
  • Adjustable drying time
  • Adjustable hot-air temperature
  • Wash and rinse pressure monitoring
  • PLC-controlled cleaning cycle

Applications

One Cleaning Platform for Multiple SMT Applications

BC320 is presented for the following SMT cleaning applications in the supplied product information.

01

Solder Paste Stencil

02

Red Glue Stencil

03

Copper Stencil

04

Misprinted PCB

05

Squeegee

06

PCBA

Cleaning Results

Before and After Examples

Comparison images are reproduced from the BC320 product introduction without alteration.

Solder Paste Stencil

Before / After

Solder paste stencil before cleaning
Before
Solder paste stencil after cleaning
After

Copper Stencil with Red Glue

Before / After

Copper stencil with red glue before cleaning
Before
Copper stencil with red glue after cleaning
After

Resin Stencil with Red Glue

Before / After

Resin stencil with red glue before cleaning
Before
Resin stencil with red glue after cleaning
After

Real Machine Video

BC320 Machine Demonstration

See the BC320 machine, cleaning chamber, touch-screen interface and operating process in this real-machine demonstration.

  • Original supplied MP4, retained for direct playback.
  • Video is not set to autoplay, loop or preload the full file.
  • Poster image is a real frame extracted from this demonstration.
Open Video File

Technical Specifications

BC320 Machine Specifications

Values below are organized from the supplied BC320 Machine Spec page.

ItemSpecification
ModelBC320
Maximum stencil size737 × 737 × 40 mm
Cleaning liquid tank60 L
DI water tank60 L
Wash time (solder paste stencil)3–5 min
Rinse time (solder paste stencil)1–2 min
Drying time (solder paste stencil)3–6 min
Wash / rinse pressure4–5 kg/cm²
Cleaning liquidWater-based cleaning liquid
Rinse mediumDI water
Drying methodHot air blow drying
Cleaning liquid temperature0–60°C
Hot air temperature0–90°C
Cleaning liquid heater9 kW
DI water heater9 kW
Hot air heater6 kW
Cleaning / rinse filtration1 μm / 1 μm
Power supplyAC 380 V, 50/60 Hz
Rated power28 kW
Compressed air0.5–0.7 MPa
Net weight730 kg
Machine dimensions1300 × 1400 × 1950 mm

FAQ

BC320 Buyer Questions

Answers below are limited to the supplied product introduction and machine specification.

What can the BC320 clean?

It is presented for SMT solder paste stencils, red glue stencils, red glue copper stencils, solder paste misprinted PCBs, squeegees and PCBA.

What is the maximum stencil size?

The maximum stencil size is 737 × 737 × 40 mm.

Does the BC320 use DI water?

Yes. DI water is specified as the rinse medium, with a 60 L DI water tank.

How is the stencil dried?

The machine specification lists hot air blow drying, with a hot-air temperature range of 0–90°C.

What filtration precision does the machine use?

Cleaning and rinse filtration are both specified as 1 μm.

What utilities are required for installation?

The machine is specified for AC 380 V, 50/60 Hz power, rated at 28 kW, and compressed air at 0.5–0.7 MPa. It uses water-based cleaning liquid and DI water.

Technical DocumentsDownload the original BC320 product introduction supplied with this page.

Download BC320 Product Introduction

Talk to Southern Machinery

Looking for a Stencil Cleaning Solution?

Tell us your stencil size, cleaning material and process requirements. We can help you evaluate whether the BC320 is suitable for your application.

For a quote or application discussion, contact the Southern Machinery team directly.