Load
Load PCB assemblies into the two-level fixture.
Offline Batch PCBA Cleaning System
SME5600D PCBA Cleaning Machine
Integrated Clean · Rinse · Dry for SMT & THT Assemblies
A controlled offline batch cleaning system combining chemical spray cleaning, DI-water rinsing and hot-air drying in one automatic process.
Designed for removing flux residues, solder-paste contamination and other organic or inorganic residues from SMT, THT and mixed-technology PCB assemblies.
- Two-level loading fixture
- Three rotating spray levels
- Recipe-based process control
Integrated batch cycleChemical spray · DI rinse · hot-air dry
3Rotating spray levels
2Loading levels
610 × 560 × 100 mmBasket size per level
30–80 PSIAdjustable spray pressure
RT–99°CDrying temperature
0–18 MΩRinse resistivity monitoring
Controlled Cleaning Cycle
One Machine. One Controlled Cleaning Cycle.
One automatic cycle sequences chemical spray cleaning, DI-water rinsing and controlled hot-air drying. Time, temperature, rinse cycles, spray pressure and drying conditions can be adjusted according to the actual PCBA and validated cleaning process.
01
Chemical Spray Clean
Recirculated cleaning liquid sprays the loaded assemblies through the cleaning stage.
02
DI-Water Rinse
Adjustable DI-water spray rinsing removes cleaning-agent residue and contamination.
03
Hot-Air Dry
Controlled hot-air drying removes residual moisture before inspection.
01 → 02 → 03Three stages. One controlled batch process.
01Chemical spray cleaning
02DI-water rinse
03Hot-air drying
Cleaning Workflow
From Loading to Final Inspection
The workflow provides a repeatable sequence while leaving the process recipe available for engineering adjustment.
Set
Select the validated process recipe.
Spray Clean
Recirculated chemical spray removes residues.
DI-Water Rinse
Adjustable DI-water spray rinsing removes cleaning-agent residue and contamination.
Hot-Air Dry
Controlled hot-air drying removes residual moisture.
Inspect
Unload, inspect and complete required functional checks.
RECIRCULATED CHEMICAL LOOP → DI-WATER RINSE → HOT-AIR DRY
Final settings should be confirmed according to the assembly, flux type, cleaning agent, component sensitivity and required inspection method.
Spray Access
Three Spray Levels Improve Cleaning Access
Upper, middle and lower rotating spray bars support access around a two-level loading fixture.
01
Upper Spray Bar
Sprays downward toward the upper loading level.
02
Middle Spray Bar
Provides spray access between the two loaded PCBA levels.
03
Lower Spray Bar
Sprays upward toward the lower loading level.
Actual spray coverage and process settings are confirmed with representative assemblies.
Upper sprayMiddle sprayLower spray
Batch Loading
Two Loading Levels for Flexible PCBA Batches
The SUS304 stainless-steel fixture and basket structure supports batch cleaning with loading adjusted to the actual PCB size and fixture arrangement.
- Cleaning basket size: 610 × 560 × 100 mm × 2 layers
- Two loading levels with PCBA fixture support
- Batch quantity depends on board size, component height, spacing and fixture arrangement
- Double-sided assemblies require fixture and process validation
Assembly Fit
Built for SMT, THT and Mixed Assemblies
The cleaning process can be evaluated against the actual PCBA, contamination profile, cleaning chemistry and agreed inspection method.
Process evaluation before production release
Representative assemblies make it possible to assess loading, material sensitivity, cleaning access, drying and final inspection requirements before the production recipe is released.
SMT Assemblies
For flux-residue cleaning evaluation on surface-mount PCB assemblies.
THT Assemblies
For through-hole assemblies requiring an offline batch cleaning process.
Mixed SMT / THT
For boards combining surface-mount and through-hole components.
Double-Sided PCBAs
Subject to fixture and process validation.
Residues the Process Can Be Evaluated For
The process can be evaluated for rosin flux residue, water-soluble flux residue, no-clean flux residue, solder-paste balls, organic contamination and inorganic contamination.
Aerospace Electronics
Medical Electronics
New Energy
Automotive & High-Value Electronics
Illustrative Cleaning Example
Before & After Cleaning
Drag the control to compare the supplied example. This is an illustrative cleaning example only.
Actual results depend on PCBA design, contamination, flux type, cleaning chemistry, temperature, spray pressure, cycle time and validated process settings.
Adjustable Process Control
Tune the Process for Each Assembly
Process ranges support recipe development. Final production settings should be confirmed with representative assemblies.
0–99 minCleaning time
RT–75°CCleaning-liquid temperature
1–99Rinsing cycles
1–2 minTime per rinse
RT–75°CRinse-water temperature
0–99 minDrying time
RT–99°CDrying temperature
30–80 PSISpray pressure
Typical Process Development Window — reference only, not a fixed production recipe.
10–20 minCleaning
1–2 minEach rinse
3–5Rinse cycles
20–30 minDrying
40–60°CCleaning temperature
Room temperatureRinse temperature
70–95°CDrying temperature
40–60 minTypical total process time
These are general reference values from the source material. Actual settings depend on the assembly and process validation.
Fluid Management
Controlled Fluid Management
The supplied information identifies heated process tanks, chemical recirculation, filtration, pressure indication and rinse-water monitoring.
Concentrate / dilution tank
5.5 kW main pump
Spray cleaning in chamber
0.22 μm filtration
Return through chemical loop
30 L / 60 L / 18 LConcentrate, dilution and spray tank capacities
0.22 μmChemical-liquid and DI-water filtration
3 gaugesReal-time pressure indication for key circuits
0–18 MΩRinse resistivity monitoring range
Machine Detail Gallery
Inside the SME5600D
All gallery images originate from the supplied PDF and PPT product material. Select an image to inspect it.
Machine Overview
Key Machine Areas
Select a hotspot to review the visible equipment area. On mobile, use the numbered list alongside the image.
01Viewing window and cleaning chamber access
02Exhaust and top-cover area
03Regulator, control panel and LCD interface
04Electrical control box and power switches
05Side cover and lower service area
06Front door and PCBA fixture area
Top Cover & ExhaustThe supplied machine overview identifies the top-cover and exhaust area above the cleaning chamber.
Technical Specifications
Core Specifications for Engineering Review
The following specifications come from the supplied product material. Final configuration follows order engineering review.
Process & Loading
- Cleaning basket
- 610 × 560 × 100 mm × 2
- Cleaning time
- 0–99 min, adjustable
- Cleaning temperature
- RT–75°C
- Rinsing cycles
- 1–99
- Time per rinse
- 1–2 min
- Rinse temperature
- RT–75°C
- Drying time
- 0–99 min
- Drying temperature
- RT–99°C
- Spray pressure
- 30–80 PSI
Fluid System & Heating
- Concentrate tank
- 30 L
- Dilution tank
- 60 L
- Spray tank
- 18 L
- Rinse resistivity monitor
- 0–18 MΩ
- Tank heaters
- 6 kW / 9 kW
- Drying heater
- 6 kW
- Main pump
- 5.5 kW
- Chemical / DI filter
- 0.22 μm
- Pressure gauges
- 3 pcs
Utilities & Machine
- Power supply
- AC 380 V / 50 Hz / 65 A
- Compressed air
- 0.45–0.7 MPa
- Water inlet / outlet
- 1 inch fast junction
- Chemical inlet
- 1 inch fast junction
- Machine weight
- 600 kg
- Machine dimensions
- Confirm current GA drawing
Final configuration note. Utility standard, dimensions, connection details and machine configuration should be confirmed during order engineering review.
Sample Validation
Sample Testing Defines the Final Recipe
A representative assembly allows Southern Machinery and the customer to agree the cleaning process before production release.
01
Review the Assembly
Confirm board dimensions, maximum component height and fixture loading.
02
Check Sensitive Materials
Review relays, connectors, labels, plastics, adhesives and moisture-sensitive parts.
03
Run Conservative Trials
Start with controlled temperature, pressure and cycle time.
04
Inspect & Test
Assess flux residue, trapped liquid, material changes, drying and electrical function.
05
Freeze the Recipe
Release production settings after the representative sample passes agreed checks.
FAQ
Questions Before Process Evaluation
For project-specific points, share a representative assembly so the process can be reviewed against the actual application.
What does the SME5600D clean?
The process can be evaluated for rosin, water-soluble and no-clean flux residues, solder-paste balls, and mixed organic or inorganic contamination. Final results depend on the actual board, chemistry and validated settings.
Is it suitable for both SMT and THT assemblies?
Yes. The SME5600D is positioned for SMT, THT and mixed-technology PCB assemblies. Double-sided boards are subject to fixture and process validation.
Can it remove no-clean flux?
It can be evaluated for no-clean flux residues, subject to the actual flux chemistry and validated cleaning process.
Does the machine include rinsing and drying?
One automatic cycle sequences chemical spray cleaning, DI-water rinsing and controlled hot-air drying.
How many PCBAs can be cleaned per batch?
Batch quantity depends on PCBA size, component height, spacing and fixture arrangement. It should be confirmed with the customer’s representative assemblies.
What is the cleaning basket size?
The supplied specification lists 610 × 560 × 100 mm × 2 layers.
Are spray pressure and cleaning temperature adjustable?
Yes. The source material lists adjustable spray pressure of 30–80 PSI, cleaning-liquid temperature of RT–75°C, and drying temperature of RT–99°C.
How long does one cleaning cycle take?
Cleaning and drying time are adjustable from 0–99 minutes. The older source lists a typical 40–60 minute process-development reference window, not a fixed production cycle time.
Can we send PCBAs for sample testing?
Yes. A representative uncleaned PCBA, board dimensions, component height, flux or solder-paste information, sensitive materials and inspection target help define the evaluation.
Engineering Review
Send Your PCBA for Cleaning Evaluation
Share a representative uncleaned PCBA, PCB size, maximum component height, expected batch quantity, flux or solder-paste information, sensitive components and the required cleanliness or inspection method.